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Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting

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Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting

Brand Name : ZMSH

Place of Origin : China

MOQ : 1

Payment Terms : T/T

Delivery Time : 6-8months

Working Size : Φ8°, Φ12°

Tool Size : 2"-3"

Cleaning Table : 100-300 rpm

Main Spindle : Dual 1.2/1.8/2.4/3.0 kW, max 60000 rpm

Working Voltage : 3-phase 380V 50Hz

Equipment Info : 1550×1255×1880 mm

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Automated Precision Dicing Machine​
High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing

The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics, glass, and composites. Engineered with dual-spindle technology, multi-axis control, and fully automated systems, this machine delivers unmatched accuracy and efficiency for applications like wafer dicing, FPC flexible board cutting, and micro-component processing.

​Key Applications:

  • Semiconductor wafer slicing
  • Ceramic substrate division
  • Medical device manufacturing
  • Automotive electronics
  • Optical component processing

​Core Advantages:

  • Dual-spindle configuration for flexible power options (1.2/1.8/2.4/3.0 kW) and ultra-high-speed cutting (up to 60,000 RPM).
  • Multi-axis synchronization (Y1/Y2, X, Z1/Z2, O axes) ensures sub-micron precision and complex geometry handling.
  • Fully automated cleaning system for zero-defect production.

Technical Specifications

Parameter Value
Working Size Φ8″, Φ12″
Main Spindle Dual Power: 1.2/1.8/2.4/3.0 kW; Max Speed: 60,000 RPM
Tool Size 2″–3″
Y1/Y2 Axis Repeatability: ±0.0001 mm; Travel Range: <0.002 mm; Speed: 310 mm/s
X Axis Speed: 0–600 mm/s; Repeatability: ±0.001 mm
Z1/Z2 Axis Repeatability: ±0.002 mm; Travel Range: 0–600 mm/s
O Axis Rotation Angle: ±15°; Repeatability: ±0.001 mm
Cleaning Table Speed: 100–300 RPM; Fully Automatic Washing System
Working Voltage 3-Phase 380V, 50 Hz
Dimensions (L×W×H)​ 1550 × 1255 × 1880 mm
Weight 2100 kg

Performance & Quality of Dicing Machine

Precision Engineering

  • Achieves ​​±0.0001 mm repeatability​ on Y1/Y2 axes and ​​±0.002 mm on Z1/Z2 axes, ensuring consistent edge quality with minimal chipping or micro-cracks.
  • Advanced vision systems and force feedback adapt to material deformation and tool wear.

Speed & Efficiency

  • High-speed spindle (60,000 RPM) combined with 310 mm/s linear axis movement maximizes throughput without compromising accuracy.
  • Automated loading/unloading and cleaning reduce cycle time by 30%.

Durability

  • Robust construction with vibration-resistant design ensures 24/7 operation.
  • Spindle life optimized for 8,000+ hours under continuous use.

Application

Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting

  • Semiconductor: Wafer dicing for chips down to 50μm thickness.
  • Medical Devices: Precision cutting of bio-compatible materials (e.g., alumina ceramics).
  • Automotive: Flexible PCB and sensor component singulation.

ZMSH Automated Precision Dicing Machine

Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting

Frequently Asked Questions (FAQ)

Q: What materials can this machine handle?​​
A: It’s designed for cutting brittle materials like semiconductors, ceramics, glass, and composites. Common uses include slicing wafers, processing flexible printed circuits (FPC), and precision components for electronics or medical devices.

Q: How precise is the machine?​​
A: It achieves extremely fine cuts with accuracy down to ​0.0001 mm​ (thinner than a human hair). This ensures clean edges with minimal chipping, even for delicate materials.

Q: What power does it need?​​
A: It runs on standard ​3-phase 380V power​ (common in industrial settings). The dual-spindle system adapts to different materials by adjusting power output.

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