Sapphire wafer 2inch 4inch Single side Double side polish
Abstract
Our Sapphire Wafer, crafted from 99.999% pure Al2O3 monocrystal using the advanced Kyropoulos (KY) method, offers exceptional quality for semiconductor applications. Known for its superior optical transparency, outstanding mechanical strength, and excellent thermal stability, this sapphire material is perfect for high-performance LEDs, laser diodes, and other electronic and photonic devices. With precise thickness control and excellent surface quality, our sapphire wafer ensures high reliability and efficiency in demanding applications, making it the top choice for cutting-edge technology solutions.
Compony Introduction
Our company, ZMSH, has been a prominent player in the semiconductor industry for over a decade, boasting a professional team of factory experts and sales personnel. We specialize in providing customized sapphire wafer solutions, offering both tailored designs and OEM services to meet diverse client needs. At ZMSH, we are committed to delivering products that excel in both price and quality, ensuring customer satisfaction at every stage. We invite you to contact us for more information or to discuss your specific requirements.
Sapphire wafer Tecnical Parameters
| Properties | Target | Tolerance |
| Diameter | 50.8mm | ± 0.05mm |
| Thickness | 1000μm | ±15μm |
| Surface orientation of A plane | Off C-axis toM0.2° | ± 0.03° |
| Primary flat length | 16mm | ±1mm |
| Primary flat orientation | C-plane | ±0.1° |
| Back side Roughness | <0.3nm | |
| Front side Roughness | ≤0.3nm for DSP or 1.0±0.2um for SSP |
| Wafer edge | R-type |
| Total Thickness Variation, TTV | ≤ 10μm(LTV≤5μm,5*5) |
| Warp | ≤10μm |
| Bow | -8 μm ≤ BOW ≤ 0 |
| Laser Mark | N/A |
Sapphire wafer Applications
Sapphire wafers, crafted from single-crystal aluminum oxide (Al₂O₃), are integral to various high-performance applications due to their exceptional properties. Their unique characteristics include remarkable hardness, optical transparency across a broad spectrum (from ultraviolet to infrared), high thermal conductivity, and excellent electrical insulation.
Key Applications of Sapphire Wafers:
- Semiconductor Substrates:
Silicon-on-Sapphire (SOS) Technology: Sapphire wafers serve as substrates for silicon-on-sapphire integrated circuits, offering benefits like high-temperature stability and radiation resistance.
Gallium Nitride (GaN) Device Fabrication: They provide a base for GaN-based devices, including blue and ultraviolet LEDs, leveraging sapphire's insulating properties and thermal conductivity.
Windows and Lenses: Sapphire's optical clarity and durability make it ideal for windows and lenses in demanding environments, such as high-pressure chambers and infrared optical systems.
Laser Components: Used in certain laser systems, sapphire's properties contribute to efficient lasing and beam quality.
- Microelectromechanical Systems (MEMS):
Structural Components: The mechanical strength of sapphire wafers supports MEMS devices, including accelerometers and gyroscopes, enhancing their performance and reliability.
- Optoelectronic Applications:
Photonics Platforms: Sapphire substrates are utilized in photonic devices, benefiting from their low optical loss and compatibility with various laser gain media.
Protective Windows: Due to their hardness and optical properties, sapphire is used in transparent armor applications, providing protection while maintaining optical clarity.
The versatility of sapphire wafers across these applications underscores their importance in advancing technology that demands durability, transparency, and high performance.
Product Display - ZMSH
- 2 inch double side polish sapphire wafer
- 4 inch single side polish sapphire wafer
Sapphire wafer FAQ
Q: How to make a sapphire wafer?
A: Sapphire wafers are fabricated by slicing high-purity sapphire crystal boules into thin discs. The process involves:
- Orientation: Precisely aligning the crystal on the slicing machine.
- Slicing: Cutting the crystal into thin wafers.
- Grinding: Removing slicing damage and improving flatness.
- Chamfering: Beveling edges to enhance mechanical strength.
- Polishing: Achieving a smooth, precise surface finish.
- Cleaning: Eliminating surface contaminants.
- Quality Inspection: Ensuring wafers meet specified standards.
Q: How to cut a sapphire wafer?
A: Cutting sapphire wafers requires specialized techniques due to sapphire's hardness and brittleness. Common methods include:
- Laser Scribing and Cleaving: Ultraviolet lasers create precise scribe lines, which are then cleaved mechanically, minimizing chipping and preserving device integrity.
- Mechanical Dicing: Diamond-embedded blades saw through the wafer, though this can cause chipping and may require additional polishing.
Q: What size are sapphire wafers?
A: Sapphire wafers are available in various diameters, commonly ranging from 2 inches (50.8 mm) to 12 inches (300 mm). Standard sizes include 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch wafers. Larger diameters, such as 8-inch and 12-inch wafers, are increasingly utilized to enhance productivity and reduce costs in semiconductor manufacturing.
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Sapphire Wafer 2inch 4inch Single Side Double Side Polish 350um Thickness Crystal Orientation C-plane Images
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